Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing ...

The new facilities, expected to be completed by December 2027, will feature advanced packaging lines for HBM chips, which are ...

HANOI ― Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing investments, as a shifting of industrial activity away from China gathers ...

Few chip companies are as well positioned to flourish under Donald Trump’s presidency as specialized semiconductor equipment ...

The CHIPS Act is providing funding and tax breaks for multiple semiconductor makers to build new plants and R&D facilities on ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased ...

TSMC's 5nm and 3nm production lines are 'fully loaded' until 1H 2025 due to 'strong orders' for AI chips, Qualcomm + MediaTek ...

Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing ...

TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

The new facilities, expected to be completed by December 2027, will feature advanced packaging lines for HBM chips, which are ...

Clemson University researchers are investigating football helmet safety by focusing on faceguard failures. Led by bioengineering professor John Desjardins, the study tests the structural integrity of ...

Summary President Biden is accelerating CHIPS Act funding before President-elect Trump’s administration begins in January. Analysts expect Trump to support more tariffs and stricter export controls ...