TDK introduces the InvenSense SmartMotion ICM-536xx six-axis IMUs, supporting optical image stabilization for mainstream ...

Microchip’s Adaptec SmartRAID 4300 series of NVMe RAID storage accelerators delivers up to a 7× increase in improvement over ...

Samtec has developed several evaluation kits to validate that its interconnects meet military performance requirements.

G and RF chip startups in EE Times’ Silicon 100 report address the biggest pain points in designing for 5G wireless devices ...

Nexperia introduces five 1-V ESD protection diodes to protect USB4 and Thunderbolt interfaces in a range of applications.

TDK’s EPCOS B3264xH series of film capacitors meets the demands of high-frequency applications in advanced power electronics ...

OKI Circuit Technology’s rigid-flex PCBs feature embedded copper “coins” that improve heat dissipation for space applications ...

Intermediate bus converters address key concerns such as efficiency, power loss, thermal dissipation, and size in data ...

Silicon Labs claims the first PSA Level 4 security certification with the Series 3 SiXG301 multi-protocol wireless SoC.

KD, Leopard Imaging, and Corning collaborate on an IEEE 802.3cz–compliant multi-gigabit optical camera for automotive ...

TI’s BQ41Z90 and BQ41Z50 battery gauges with a predictive battery model enables precise battery monitoring for longer battery ...