A Theoretical Framework for Time, Space, and Energy Scaling” was published by researchers at Sandia National Laboratories.

Nobody wants standards until the lack of them inhibits the development of the solutions that they need. That is often too ...

A new technical paper titled “Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography ...

Enabling full multi-die system functional verification and early testing long before interposer characteristics are pinned ...

A Hardware Performance Counter-Based Intrusion Detection System for DoS Attacks on Automotive CAN bus” was published by researchers at Dumarey Softronix and Politecnico di Torino. Abstract “The ...

Avoiding End-to-End Slowdowns in Accelerated Chip Multi-Processors” was published by researchers at Cornell University and Intel Labs. Abstract “Recent chip multiprocessors incorporate several on-chip ...

Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers at Georgia Institute of Technology. Abstract “Conventional large language ...

Practical insights into the quantum landscape of 2025 and how organizations can benefit from this technological revolution.

Memristors in action: Sort-in-memory, a nervous system for robots, RF signal processing. Researchers from Peking University ...

This report focuses on different interconnect structures, such as lines, vias, buses, and networks-on-chip, and how they’re ...

Bigger designs with hundred of cores are creating an explosion in the volume of scan test data, significantly bumping up the amount of time spent on test. That raises the cost of test, forcing ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...