Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing ...

Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing ...

HANOI ― Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing investments, as a shifting of industrial activity away from China gathers ...

The CHIPS Act is providing funding and tax breaks for multiple semiconductor makers to build new plants and R&D facilities on ...

TSMC's 5nm and 3nm production lines are 'fully loaded' until 1H 2025 due to 'strong orders' for AI chips, Qualcomm + MediaTek ...

TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

The Kyoto-based company has set aside $60 million to invest in early-stage startups in the U.S., the Middle East and Africa through its Kyocera Venture Fund-I over a 10-year period. It is pouring ...

The new facilities, expected to be completed by December 2027, will feature advanced packaging lines for HBM chips, which are ...

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Taiwan Semiconductor is set to double its production capacity for advanced packaging, a move driven by the increasing demand ...

Microsoft has revealed its CPU support list for Windows Server 2025 that includes the surprising entry of the Pentium G7400 ...