TDK introduces the InvenSense SmartMotion ICM-536xx six-axis IMUs, supporting optical image stabilization for mainstream ...

Microchip’s Adaptec SmartRAID 4300 series of NVMe RAID storage accelerators delivers up to a 7× increase in improvement over ...

Samtec has developed several evaluation kits to validate that its interconnects meet military performance requirements.

G and RF chip startups in EE Times’ Silicon 100 report address the biggest pain points in designing for 5G wireless devices ...

TDK’s EPCOS B3264xH series of film capacitors meets the demands of high-frequency applications in advanced power electronics ...

Nexperia introduces five 1-V ESD protection diodes to protect USB4 and Thunderbolt interfaces in a range of applications.

OKI Circuit Technology’s rigid-flex PCBs feature embedded copper “coins” that improve heat dissipation for space applications ...

Intermediate bus converters address key concerns such as efficiency, power loss, thermal dissipation, and size in data ...

Silicon Labs claims the first PSA Level 4 security certification with the Series 3 SiXG301 multi-protocol wireless SoC.

Efficient Computer’s Electron E1 general-purpose processor claims up to 100× higher energy efficiency than general-purpose ...

KD, Leopard Imaging, and Corning collaborate on an IEEE 802.3cz–compliant multi-gigabit optical camera for automotive ...

The automotive industry’s shift toward EVs, AVs, and connected cars calls for continual improvements in enabling technologies ...